Many electronic devices in use today must operate reliably in extremely harsh environments. Micron understands the critical nature of these applications and the stresses to which they are subjected.
Extended/Industrial Temperature
Servers in data centers worldwide use substantial electrical energy. To address global power consumption, Micron has developed an energy-efficient line of DRAM products targeted at these power hungry data centers.
Requirements for smaller form factors and higher memory densities are fueling the need for bare die memory solutions due to their superior flexibility.
Bare Die
Osmium technology, with its unique blend of patented and advanced wafer-level packaging technologies, delivers extremely high density semiconductor solutions in ultra-small form factors.
Osmium™ Packaging Technology
The primary objective of Micron Ventures is to assist Micron Technology in supporting the long-term needs of its customers in the communications, automotive, medical, computing, and consumer electronics markets.
Micron Ventures
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